Engineering, manufacturing, and technology solutions for markets that demand high-reliability.
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Our vision is to positively impact lives by solving complex challenges with our customers, creating innovative products that no one imagined were possible.
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Bridging the gap between innovation and marketability
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Your full solution partner of choice
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Lark TechnologyDiscover a different type of magicBuy now
Secure TechnologySecure lab tested technology, with battle-tested durability
Precision Technologies Hone in on agility and accuracy
Connected TechnologyDevelop custom connected devices
Advanced TechnologyAccess tomorrow's technology today

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Combining a wide variety of raw materials with in-house expertise in design and fabrication, dreamgame Agent Lark Technology can match the materials to the mission. A foundation must be built from high-quality raw materials for many components, circuits, and system designs. dreamgame Agent Lark Technology achieves practical, high-performance solutions by starting with substrate materials—knowing which materials will deliver the highest performance and reliability for a specific application. Lark’s substrate-agnostic manufacturing processes let us deliver complex circuits reliably when material selection is already finalized.

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The variety of different substrate materials for high-speed digital circuits, RF and microwave circuits, power circuits, mixed-signal circuits, multifunction assemblies, and packaging can be overwhelming. When seeking the optimum material choices for different applications, Lark’s engineers are well versed in the benefits of various material technologies and the critical differences among material types. They bring experience and expertise in an extensive assortment of electronic and optical materials to gain the highest performance.

dreamgame Agent Lark Technology is especially capable in circuit fabrication using high layer count Liquid Crystal Polymer (LCP). Temperature-stable, high-performance LCP circuit materials are capable of supporting 25-μm transmission lines and spaces in high-speed digital and RF through millimeter-wave circuits. In-house manufacturing capabilities repeatably produce high-density multilayer PCBs with ten or more circuit layers for demanding size, weight, and power (SWaP) requirements.

Often it is a mix of several different materials, such as electro-optical circuits and systems, that leads to the best, most cost-effective performance. Whatever the application, the engineers at Lark are familiar with the electrical and mechanical characteristics of the substrate materials required as part of engineering and manufacturing processes for optimum performance and excellent long-term reliability under the most hostile operating conditions.

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  • Experience and expertise with critical material properties, such as dielectric constant (Dk), dissipation factor (Df), and coefficient of thermal expansion (CTE), contribute to the optimal selection of circuit materials for different electrical and mechanical requirements and operating environments.

  • In-house circuit design teams work closely with circuit manufacturing teams to develop practical, high-performance solutions with the best blend of substrate materials and component placement.

  • LCP substrates support low-loss millimeter-wave circuits through 110 GHz

  • Long experience with surface mount technology (SMT) component placement enables extreme miniaturization and single-layer and multilayer PCBs

  • Multilayer design and fabrication techniques help meet challenging SWaP goals

  • Different circuit materials eliminate performance tradeoffs of single-substrate circuit approaches.

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  • Expertise in high-performance LCP circuit materials
  • Assembly of 10 or more LCP circuit layers in compact multilayer PCBs
  • CAD tools for accurate prediction of the impact of material characteristics on high-speed, high-frequency circuits to be fabricated on different substrate materials
  • Design and manufacture of analog, digital, optical, and mixed-signal circuits on materials optimized for highest performance and reliability
  • Fabrication of 25-μm lines and spacings on LCP circuit materials for high-density, mixed-signal PCBs meeting miniaturization, and SWaP goals
  • In-house test instruments and systems to measure material electrical and mechanical properties, including temperature and humidity
  • Manufacture of multilayer, mixed-signal PCBs with substrate materials selected for optimum performance of different (analog, digital, optical, etc.) circuit functions
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  • FR-4 epoxy printed circuit board (PCB) materials
  • flexible and rigid-flex circuit materials
  • low-temperature-cofired-ceramic (LTCC) and high-temperature-cofired ceramic (HTCC) circuit materials
  • thin and thick film ceramic circuit substrates
  • gallium arsenide (GaAs), gallium nitride (GaN), and indium phosphide (InP) semiconductor substrates
  • optical polymer waveguides
  • optical flex circuit materials

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