Engineering, manufacturing, and technology solutions for markets that demand high-reliability.
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Our vision is to positively impact lives by solving complex challenges with our customers, creating innovative products that no one imagined were possible.
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Secure TechnologySecure lab tested technology, with battle-tested durability
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dreamgame Agent Lark Technology provides high-performance circuit solutions that push the limits of what is possible in high-frequency and high-speed circuit design, covering analog signal frequencies to 110 GHz and multi-gigabit data rates.

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Using a modified semi-additive manufacturing process, we fabricate ultra-high density interconnect (UHDI) circuits with 25-micron features and 10+ layers with complex circuit topologies such as blind and buried vias. Our process is substrate-agnostic, and we can work with you to identify optimal materials for your application. By combining materials, we can help you integrate digital, and RF functions on a single circuit, reducing the overall number of boards in your system for additional size, weight, and power reduction. Processes conform to IPC Class-3.

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Your circuit designs are developed with the latest computer simulation software and produced with some of the world’s most advanced circuit fabrication equipment at Lark’s RF and High-Speed Design Center of Innovation in Phoenix, AZ. The design center blends design, production, and test engineering teams to transform design concepts into solutions—quickly and cost-effectively. Beyond circuit fabrication, our integrated facility also offers microelectronics assembly, automated surface mount technology (SMT) assembly, system build, and functional RF test for assembly to the sub-system or system level. Performance is checked through all stages of development on precisely calibrated test instruments.

  • Ultra-high density interconnect (UDHI) circuits with features down to 25 μm
  • Size, weight, and power (SWaP) optimization
  • RF frequency performance up to 110 GHz
  • High-performance circuit materials to match performance and cost requirements, including hybrid mixed material multilayer PCBs
  • Multilayer circuits with embedded components
  • Extensive thermal analysis and management capabilities for increased power density
  • RF/microwave testing troubleshooting, and tuning
  • Automated analog testing (signal generation and analysis) to 110 GHz
  • Strategic co-location of circuit design and fabrication with microelectronics, SMT assembly, and RF test
  • ITAR-registered and certified to handle classified material
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